Components Research EUV Lithography Engineer

Job Description

Drives design, simulation, development, and implementation activities for scientific research projects leveraging materials, chemistry, and process innovations to del novel devices, interconnects, circuits, and systems. Investigates the feasibility of applying scientific principles and concepts to potential inventions and products years before landing on a product roadmap. Develops prototypes to demonstrate proof of concepts. Provides process solutions across different production modules including lithography and etch. Owns critical process and equipment research that enable rapid device miniaturization and the mass production of integrated circuits. Uses handson approach to plan, setup, and execute experiments in collaboration with device, module, reliability, analytical labs, and TCAD across fabrication sites and quantifies and benchmarks experimental results with best known methods and literature/academia. Leads and manages vendor engagements to support various research and development activities across devices and interconnects. Mentors external research in academia and industry consortia to help fill Intel's internal research pipeline.

Qualifications

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information.

You must possess the below requirements to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum qualifications:

• Master's degree with 2+ years experience or PHD in Chemistry, Chemical Engineering, Materials Science, Physics, Applied Physics, Electrical Engineering or related disciplines.

Preferred qualifications

• Knowledge in ebeam, deep UV or EUV lithography, directed self-assembly, and wet and dry etch.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

JobType

Hybrid